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SMT application solder paste

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SMT application solder paste

No-clean SAC305 solder paste, special formula designed for NB. Excellent ICT test pass-through characteristics, anti-NWO and HoP. EUP-1000HQR recognized by SONY and HP.
Good performance in ICT testing, anti BGA head-in-pillow.
Number
EUP-1000HQR
Classification
Application Field
Server,notebook and desktop computer.
Packing Specification
500g
Quantity
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Product Description
Product parameters

 


After reflowed, conventional solder paste will leave too much residue on the surface of ICT testing point, which results in misjudgement. By improving the flow-ability of soldering flux during reflow, EUP-1000HQR leaves nearly no residue on the surface of ICT testing point to reduce rate of misjudgement greatly.

 

 

 

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暂未实现,敬请期待
暂未实现,敬请期待
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