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Solder paste for semiconductor packaging

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Solder paste for semiconductor packaging

This product is a Sn96.5 Ag3.0 Cu0.5 lead-free solder paste, and specifically designed for the application of POP process.Consistent amount of solder paste transferred during working life.Long working life in solder paste tray.Nitrogen reflow is recommended(O2<1500ppm)
Number
EUP-159
Classification
Application Field
POP process
Packing Specification
30g
Quantity
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Product Description
Product parameters

 

 

 

Alloy
Sn96.5Ag3.0Cu0.5
Powder type
T5(15-25μm), T6(5-15μm)
Viscosity(Pa.s)
30  (Malcom,2nd 10rpm)
Flux type
ROL0
Flux content(%)
20.0

 

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暂未实现,敬请期待
暂未实现,敬请期待
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