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One component epoxy

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U-Bond Technology WAP

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Name

One component epoxy

Good bonding strength,Good hot strength.Excellent green strength Low misplacement rate.Lower moisture absorption.High thixotropic index
Number
UB-3301
Classification
Application Field
1.Power supply: red adhesive on the power board; 2.Home appliances power: SMT stencil printing red adhesive
Product Features
1.Suitable for lead-free soldering process. 2.Especially suitable for small size components high speed mounting. 3.Longer stencil open time. 4.High speed dispensing.
Packing Specification
30ML/300ML
Quantity
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Product Description
Product parameters

 

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暂未实现,敬请期待
暂未实现,敬请期待
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